Organopolysiloxanes substituted with trialkylisilylphenyl substituents



United States Patent 3,385,821 ORGANOPOLYSILOXANES SUBSTITUTED WlTH TRIALKYLSILYLPHENYL SUBSTITUENTS Tse C. Wu, 9 Clemente Lane,

Waterford, N.Y. 12188 No Drawing. Filed Nov. 21, 1966, Ser. No. 595,632 13 Claims. (Cl. 260-465) ABSTRACT OF THE DISCLOSURE High molecular weight organopolysiloxanes of improved flexibility have the average formula:

RaRbSiO where R is a particular type of trialkylsilylphenyl group and R' represents a member selected from the class consisting of monovalent aryl groups and trialkylsilylphenyl groups, a is from 0.33 to 2, b is from 0 to 1.67, and the sum of a plus I) is from 1.98 to 2.01.

This invention relates to high molecular weight organopolysiloxanes substituted with trialkylsilylphenyl substituents. More particularly, this invention relates to high molecular weight organopolysiloxanes having the average formula:

( R..R'bsio where R is a trialkylsilylphenyl group having a formula selected from the class consisting of:

( K SM SiRI/ and where R" is a member selected from the class consisting of ethyl and propyl, R is selected from the class consisting of monovalent aryl groups and trialkylsilylphenyl groups as defined for R, a is from 0.33 to 2, b is from 0 to 1.67, and the sum of a and b is from 1.98 to 2.01. Further, this invention relates to copolymeric materials containing from 0.1 to 99.9 percent of portions having the average formula:

and from 99.9 to 0.1 percent of portions having the average formula: (5) 1 \.,,,SiO

3,385,821 Patented May 28, 1968 ice due to the symmetry of the phenyl substitution. If the symmetry is broken by the inclusion of other substituents, the compounds become more flexible. However, if these other su-bstituents are alkyl, then the full effect of the high temperature and radiation resistance properties of the phenyl-substituted compounds is not realized. If the symmetry is broken by the inclusion of another aryl substituent, not only is the compound less brittle, but, additionally, the high temperature and radiation resistance properties can be realized.

Previously, aryl-substituted organopolysiloxanes have been formed with tolyl and trifiuoromethylphenylsubstituents. These polymers had the desired high temperature and radiation resistance properties and were entirely adequate for most uses. However, the polymers containing tolyl groups were subject to cross-linking if heated in the air for a sufficient period of time. The polymers containing the m-trifluoromethylphenyl groups, while not subject to cross-linking, had a tendency to de-polymerize upon continued heating.

In contradistinction to these prior aryl-substituted polymers, I have unexpectedly discovered that polymers substituted with trialkylsilylphenyl groups not only retain the high temperature and radiation resistance properties of aryl polysiloxanes, generally, but, in addition, are flexible, stable when heated in the air, and, in fact, have high temperature stability properties equivalent to those of polytetrafiuoroethylene. Further, copolymers can be prepared employing organopolysiloxanes substituted with other aryl groups, such as, for example, phenyl or tolyl, in addition to the trialkylsilylphenyl-substituted units, without seriously affecting the flexibility or the thermal stability. In fact, up to 10 percent of the total organic substituents on the organopolysiloxane can be alkyl, without a significant impairment of the high temperature properties.

The polymers of the present invention are formed by the polymerization of cyclopolysiloxanes, particularly cyclotrisiloxanes substituted with trialkylsilylphenyl groups. The polymerization can be either a homopolymerization, involving a cyclopolysiloxane, particularly a cyclotrisiloxane, substituted either completely or partially with trialkylsilylphenyl groups, or it can involve a copolymerization between such a cyclotrisiloxane and a cyclopolysiloxane substituted with aryl groups or, as previously mentioned, with alkyl groups up to a total of 10 percent of the total substituents.

The cyclopolysiloxanes which are involved in a copolymerization are those described in my copending application, Ser. No. 595,631, filed of even date herewith, and assigned to the same assignee as the present invention. These cyclotrisiloxanes have the formula:

where R and R are as previously defined. Copolymerized materials are formed by polymerizing a material of Formula 6 with a cyclopolysiloxane of formula:

where R' is as previously defined and n is an integral number of from 3 to 10. Included within the definitions of the cyclopolysiloxane of Formula 6 are, for example,

hexakis (m-trimethylsilylphenyl cyclotrisiloxane,

hexakis (p-trimethylsilylphenyl cyclotrisiloxane,

2,2-diphenyl-4,4,6,6-tetrakis(m-trimethylsilylphenyl) cyclotrisiloxane,

2,2-bis(m-trimethylsilylphenyl) tetraphenylcyclotrisiloxane,

2,2-bis (p-trimethylsilylphen yl tetraphenylcyclo trisiloxane,

2,4,6-triphenyl-2,4,6-tris (m-triethylsilylphenyl cyclotrisiloxane,

2-phenyl-2- o-trimethylsilylphenyl -4,4, 6,6-tetratolylcyclotrisiloxane,

2-phenyl-2- (p-tripropylsilylphenyl) -4,4,6,6-tetrakis(mtrimethylsilylphenyl cyclotrisiloxane, and

2,2-ditolyl-4,4,6, 6-tetrakis (m-triethylsilylphenyl) cyclotrisiloxane Among the materials included within Formula 7 are hexaphenylcyclotrisiloxane, hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, hexatolylcyclotrisiloxane, and other, higher molecular weight cyclopolysiloxanes, or such cyclopolysiloxanes having mixed substituents within the general definition of RI).

When cyclic polysiloxanes having alkyl groups are employed, the resulting polymer film has greater flexibility than when employing purely aryl groups or the trialkylsilylphenyl groups of the present invention, but a certain amount of the heat stability is sacrificed. However, as previously mentioned, the inclusion of up to 10 percent alkyl groups on the in-chain silicon atoms does not present a suflicient impairment of the heat stability properties to be problematical. Preferably, the high molecular weight organopolysiloxane substituted with trialkylsilylphenyl groups, formed by either the homopolymerization or the copolymerization, should have an intrinsic viscosity of at least 1.0. When the intrinsic viscosity is below this figure of 1.0, the films which are formed from the polymer generally do not have sufiicient strength to be practically useful.

In order to produce a cross-linkable polymer either with the aforementioned homopolymer or copolymer, the cyclotrisiloxane of Formula 6, with or without the material of Formula 7, should be copolymerized with organopolysiloxanes containing vinyl substitutents on the chain silicon atoms, such as materials of formula:

where R' and n are as previously defined, and c is from 0.33 to 1.0. For example, 2-methyl-2-vinyl-4,4,6,6-tetraphenylcyclotrisiloxane can be employed, as can other vinyl-substituted organopolysiloxanes, either cyclic or straight chain materials. The amount of material containing silicon-substituted vinyl members should be in the range of from 0.5 to percent, and preferably about 3 percent when employing a material such as the aforementioned Z-methyl 2- vinyl -4,4,6,6-tetraphenylcyclotrisiloxane. In the copolymer, these materials have the average formula:

(9) (CHFCH).

-SiO- (I LIII)Z O where R and c are as previously defined. The vinylsubstituted materials are especially useful in the formation of a film by cross-linking and do not significantly affect the heat stability of the resultant polymer.

The process for forming the high molecular weight organopolysiloxanes substimted with trialkylsilylphenyl groups, according to the present invention, is the same whether it is a homopolymerization or a copolymerization. The polymerization can be accomplished in the presence or in the absence of a solvent. The cyclotrisiloxanes to be polymerized should be present in amounts varying from 20 to 100 percent of the total polymerization mixture and the solvent in an amount of from about 80 percent to 0 percent of the total polymerization mixture. If a solvent is employed, it should be an aliphatic hydrocarbon solvent having from about 6 to 16 carbon atoms, or from about hexane to hexadecane in the parafiin series. The requirements are that the boiling point of the solvent not be so low that it is boiled away prior to completion of polymerization and that the melting point he sufliciently low that the solvent is a liquid at about room temperature.

The polymerization is generally conducted at a temperature of about 110 C., when using a low boiling solvent. When a higher boiling solvent is employed, or when no solvent is used for the polymerization, the temperature can vary from 110 C. up to about 40-50 C. above the melting point of the cyclotrisiloxane to be polymerized, or about 40-50 C. above the melting point of the highest melting of the cyclopolysiloxanes used in a copolymerization. After the polymerization mixture is brought to the desired temperature, a quantity of catalyst is added. In general, any strong basic catalyst can be employed, particularly potassium naphthalene or potassium hydroxide suspended in an organopolysiloxane, such as octamethylcyclotetrasiloxane. In general, an amount of catalyst between about 20 and 200 parts per million of equivalent potassium hydroxide should be used. The amount of catalyst, so long as it is above the minimum, does not affect the molecular weight of the ultimately formed organopolysiloxane. Following addition of the catalyst, the polymerization mixture, which is stirred from a time at least just prior to the addition of the catalyst, increases very rapidly in viscosity and, often, the viscosity increases sufficiently to prevent movement of the stirrer within only a few seconds. However, heating of the; polymerization mixture is continued for from about 3 to 30 minutes in order to assure completion of polymerization.

After this heating is completed, the polymer must be decatalyzed in order to prevent depolymerization of the formed material. Among the materials which can be employed to effect this decatalysis are benzyl chloride, methyl iodide, allyl bromide, and trimethylchlorosilane. The amount of decatalyzer used should be in the range of from about to 1000 parts per million, based upon the original cyclopolysiloxanes. The decatalysis agent is added to a solvent solution of the polymerization mixture or can be added with a solvent if the polymer was prepared without solvent, and the solution is stirred for a sufficient time to assure that there is an essentially complete blending. The solvent is then removed, by heating, and the material is ready for use.

The formation of the high molecular weight organopolysiloxane substituted with trialkylsilylphenyl groups will now be described in greater detail. These examples should be considered as illustrative only, and not as limiting in any way the full scope of the invention as covered in the appended claims. All parts are by weight.

Examples 1-6 In these examples, the homopolymerization of a material having the formula:

(10) (CH:)s K HM is illustrated. This material corresponds to Formula 6 where R and the R substituent on the corresponding silicon atom are as shown in Formula 2 with the trimethylsilyl group in the para position and the remaining R groups are phenyl. In some cases, the cyclotrisiloxane of Formula 10 was copolymerized with 2-methyl-2-vinyl- 4,4,6,6-tetraphenylcyclotrisiloxane. In the table below are listed the reaction conditions and results, with the vinyl- 5 6 substituted cyclotrisiloxane being designated as A in those which correspond to Formula 9 where R' is methyl and examples where it was employed. In the table Percent phenyl, and c is 0.33. Polysiloxane indicates the concentration of the cyclotri- Fil hi h were cast i h f these polymers siloxanes in the total polymerization mixture, Induction from a chloroform Solution, were clear, transparent, and

Time indicates the time until the stirrer stopped because 5 of the increased viscosity of the polymerization mixture, Additional Heating Time indicates the number of minutes for which heating was continued after the stirrer flexible. Additionally, fibers were formable from the polymers employing either melt spinning or wet spinning. The polymer of Example 4, when press-cured at 150 C. un-

stopped, and Intrinsic Viscosity indicates the molecular def a Pressure of 100000 employing about P weight of the finally formed polymer in deciliters per 10 cent dicumyl PefOXide as a Catalyst, Produced a film gram having a tensile strength of 1800 p.s.i. at an elongation of TABLE I Percent Copolymerized Bath Tem- Induction Additional Intrinsic Example Solvent Polysiloxane Materials perature Catalyst Time Heating Time Viscosity 0.) (seconds) (minutes) (dl./g.)

150 Sodium naphthalene 104 3. 18

150 Potassium naphthalene 2 15 3. 06

In each case the cyclotrisiloxane, and the solvent, when 140 percent. A post cure of this film for 2 hours at 200 employed, were placed in a reaction vessel which was C. resulted in a film with a tensile strength of 4200 psi heated, while stirring the polymerization mixture, until and, essentially, no elongation. the trimer melted. A vacuum was then applied to remove When heated in air, in the absence of a cross-linking traces of volatile impurities, such as any of the solvents catalyst, there was no cross-linking of the polymer as employed for recrystallization which remained in the had been experienced in the case of the tolyl-substituted trimers. Nitrogen was introduced into the reaction vessel organopolysiloxanes. A thermal gravimetric analysis was in order to release the vacuum and an amount of the performed on the polymer of Example 1. When this polystated catalyst, dissolved in tetrahydrofuran, equivalent to mer was heated in dry air at 480 C., it lost about 10 40 p.p.m. of potassium hydroxide, based upon the total percent of its weight per hour. This rate of loss is essencyclopolysiloxane employed, was then added. Heating was tially equivalent to that of polytetrafiuoroethylene and is continued until the stirrer stopped clue to the increased much better than that of most organopolysiloxanes. By viscosity and then for an additional time, as indicated. contrast, a dimethylpolysiloxane loses about 10 percent of The polymer was then dissolved in toluene containing its Weight when heated in dry air at only 350 C. about 200 parts per million of triethylphosphate, based Further the polymers of the present invention exhibit upon the original cyclotrisiloxanes, to neutralize the catexceptional reversion resistance. A portion of a film made alyst employed, and the polymer was then reprecipitated from the polymer of Example 4 was placed in water within with hexane, so as to remove the low molecular Weight a sealed tube. The tube and its contents were heated at fractions. The resulting polymer was redissolved in 175 C. for a period of 48 hours. After this period the toluene, filtered, and dried. The intrinsic viscosity deterfilm was removed and was found to be essentially unmination was conducted at 25 C. changed in appearance.

Thus, it can be seen that employing a variety of conditions, as set forth in the general description of the process, a polymer is formed in Examples 1-4 having the average formula:

Examples 7-15 In this series of examples, polymers were prepared from (11) 50 2,2-bis (m-trimethylsilylphenyl)-4,4,6,6 tetraphenylcyclo- 1 as trisiloxane of formula:

(CI-hhSi- Si(CHa)s I Si(CHs)3 0.07

which corresponds to Formula 1 where R is as shown in Formula 2 with the trimethylsilyl group in the para position, R is phenyl, a is 0.67, and b is 1.33. Similarly, in si O- si Examples 5 and 6 a copolyrner is formed having 97 percent portions of average Formula 11 and 3 percent portions of average formula:

which corresponds to Formula 6 where R and the R (12) substituent on the corresponding silicon atom are as shown in Formula 2 with the trimethylsilyl group in the meta position, and each of the other R substituents is phenyl.

CII1=CH In each case, the above-mentioned cyclotrisiloxane was g i g i o g i o 7 copolymerized with 2-methyl-2-vinyl-4,4,6,6-tetraphenyl- 1:11 i cyclotrisiloxane in an amount of 3 percent. The procedure 3 was the same as that for the polymers of Examples l-6, employing potassium naphthalene, in an amount equivalent to 40 p.p.m. as potassium hydroxide, based on the polysiloxane, as the catalyst in each example. The conditions of reaction and results are shown in Table II, with the same a tensile strength of 2300 p.s.i. with essentially no elongadesignations as in Table I: tion.

TABLE II Percent Poly- Bath Tem- Induction Additional Intrinsic Example Solvent siloxane perature Time Heating Time Viscosity C.) (seconds) (minutes) (dl./g.)

The resulting copolymers consisted of 97 percent portions The polymer of Example 15 was subjected to the reverof average formula: sion resistance test as previously described for the polymer of Example 4. Again, after heating for 48 hours at 175 C., 20 the film removed from the sealed tube was essentially unchanged in appearance.

Examples 16-17 Two polymers were formed from hexakis(p-trimethylsio silylphenyl)cyclotrisiloxane of formula:

C 0.57 onmsi SKCHD:

corresponding to Formula 1 where R is as shown in Formula 2 with the trimethylsilyl group in the meta position, R is phenyl, a is 0.67, and b is 1.33; and 3 percent of the portions of average formula:

(CHIQB i S i(CHJ)J 2) {D Q which corresponds to Formula 6 where R and each R substituent are as shown in Formula 2 with the trimethyl- CHFEHI I I silyl group in the para position. The polymerization pro- -SiOSiO-Si-O cedures were the same as those employed for Examples 1 1-6, using potassium naphthalene, in an amount equivalent to 40 p.p.m. as potassium hydroxide based on the polysiloxane, as the catalyst in each example. In each of the examples, the material was homopolyrnerized and the conditions of reaction and results are as shown in Table III,

employing the same designations as in Table I:

TABLE III Percent Poly- Bath Tem- Induction Additional Intrinsic Example Solvent siloxane perat e Time Heating Time Viscosity 0.) (seconds) (minutes) (dl./g.)

16 Heptane 37.5 110 90 15 1.36 None 100 225 3 1.21

which corresponds to Formula 9 as described for Exam- The resulting polymers thus had recurring units of forples 1-6. mula:

Films could be formed from the polymers just de- (16) SiwHm scribed, as with those formed with the cyclotrisiloxane substituted with p-trimethylsilylphenyl groups. However, the films formed with the polymers in this series of examples were somewhat softer than those formed from the polymers of the preceding examples. Again, films cast 2 from chloroform solutions were clear, transparent, and flexible, and fibers could be formed from the polymers by either melt or wet spinning. The polymer of Example 10 corresponding to Formula 1 where R is as shown in Forwas treated with about 0.5 percent dicumyl peroxide and mula 2 with the trimethylsilyl group in the para position, was then press-cured at C. and 1000 p.s.i. for 15 1 2, d b1 0, minutes. The resulting film showed a tensile strength of Example 13 710 p.s.i. and an elongation of percent. Post curing of this film for 2 hours at 200 C. resulted in a film having 75 In this example hexakis(m-trimethylsilylphenyl)cyclotrisiloxane was homopolymerized, the cyclic material having the formula:

reaction and results are as shown in Table IV, employing the same designations as in Table I:

TABLE IV mac} i m 5 Em... asses;

(Seconds) (Minutes) (dL/g.) (waist-Q Gawain 3; i8 mg 0 O 149 10 1.42 Si O Si 10 Thus, each of the polymers produced according to these (ember-C} @sncmh examples contained 97 percent portions of average formula:

corresponding to Formula 6 where R and each R are (-20) as shown in Formula 2 with the trimethylsilyl group in the meta position. This material was heated in hexane, in a concentration of 37.5 percent, at a temperature of 67 110 C. in the presence of a quantity of potassium naphthalene equivalent to 40 p.p.m. of potassium hydroxide based on the polysiloxane. The material increased in viscosity sufliciently to stop the stirrer in 11 seconds, but heating was continued for an additional 10 minutes, resulting in a polymer having, after recovery as in Examples K m 1-6, an intrinsic viscosity of 2.97 dl./g. with recurring units of formula:

corresponding to Formula 1 where R is as shown in For- (13) mula 2 with the trimethylsilyl group in the meta position, SKCHQ R is phenyl, a is 1.33 and b is 0.67; and 3 percent portions of Formula 12. 2 Films cast from chloroform solutions of each of these formulas were clear, transparent, and flexible. The poly- SO mers were tough, but pliable solids. Again, fibers could be formed from the polymers either by melt spinning or corresponding to Formula 1 where R is as shown in Forby wet spinning. The polymers did not cross-link when mula 2 with the trimethylsilyl group in the meta position, heated in the air, in the absence of cross-linking catalysts, a is 2, and b is 0. and the films were reversion resistant.

Examples 1941 Examples 22-24 In this series of examples, 2,2-diphenyl-4,4,6,6-tetrakis In this Series of examples equimolar amounts of 2 (m-trimethylsilylphenyl)cyclotrisiloxane, of formula: bis(m trimethy1sily1pheny1) 4,436 tetraphenylcyclo trisiloxane of Formula 13 and 2,2 bis(p trimethylsilylphenyl)-4,4,6,6-tetraphenylcyclotrisiloxane of Formula 10 were copolymerized with a quantity of 3 percent, based on the total of the two trimethylsilylphenyl-substituted (CHQ Si- Si(CH3)3 cyclotrisiloxanes, of 2-methyl-2-vinyl-4,4,6,6-tetraphenylcyclotrisiloxane. The polymerization procedures were the sl- O -Sl same as those employed 1n Examples 1-6, employing the catalyst as in Examples 7-15. The conditions of reaction ,s @SKCHW and results are as shown in Table V, with the same designations as in Table I:

TABLE v Percent Poly- Bath Tem- Induction Additional Intrinsic Example Solvent siloxane perature Time Heating Time Viscosity 0.) (seconds) (minutes) (dl./g.)

22 Hcptane 67 110 8 10 3.97 23 Hcxane 6-3 110 14 10 4.40 24 .i None 100 130 5 10 1.02

was copolymerized with 3 percent 2-methyl-2-vinyl- As with the polymers of the preceding examples, films 4,4,6,G-tetraphenylcyclotrisiloxane. The material of Forcast from the chloroform solutions were clear, transparent mula 19 corresponds to that of Formula 6 where R, the and flexible and were tough, but pliable. Each of the R substituent on the corresponding silicon atom, and two 5 polymers could be formed into fibers either by melt spin- R substituents on a second silicon atom are as shown ning or by wet spinning. in Formula 2 with the trimethylsilyl group in the meta The materials did not cross-link when heater in the air, position, and the remaining R substituents are phenyl. except in the presence of a cross-linking catalyst. The The polymerization procedures were the same as those polymer formed in Example 24 was press-cured, with employed for Examples 16. In each example the polym- 70 about 0.5 percent dicumyl peroxide catalyst, for 15 erization was carried out in hexane, with a polysiloxane content in the solution of percent, at a temperature of C., employing potassium naphthalene, in an amount equivalent to 40 ppm. of potassium hydroxide based on the cyclopolysiloxane, as the catalyst. The conditions of 75 minutes at C. and 1000 p.s.i. The resulting film had a tensile strength of 3500 p.s.i. with an elongation of about 10 percent. These polymers were also heat stable and reversion resistant.

The polymers formed from the above copolymeriza- 1 1 tions contained about 48.5 percent units of Formula 14, 48.5 percent units of Formula 11 and 3 percent units of Formula 12 which correspond to the generic formulas as described in the previous examples.

Examples 25-26 In these examples equimolar quantities of 2,2-bis(mtrimethylsilylphenyl) 4,4,6,6-tetraphenylcyclotrisiloxane of Formula 13 and 2-2-diphenyl-4,4,6,6-tetrakis(mtrimethylsilylphenyl)cyclotrisiloxane of Formula 19 were copolymerized with 3 percent, based on the total weight of the two, of 2-methyl-2-vinyl-4,4,6,6-tetrapheny1cyclo trisiloxane. The polymerization procedures were the same as those employed in Examples 1-6. Each of the polymerizations was carried out in hexane, with a polysiloxane concentration of 75 percent, at a temperature of 110 C., using potassium naphthalene as the catalyst, in an amount equivalent to 40 ppm. of potassium hydroxide based on the polysiloxane. The conditions and results of the polymerization are recorded in Table VI, with the same designations as in Table I:

TABLE VI Induction Additional Intrinsic Example Time Heating Time Viscosity (seconds) (minutes) (dl./g.)

Example 27 In this example equi-molar amounts of 2,2-(p-trimethylsilylphenyl) 4,4,6,6 tetraphenylcyclotrisiloxane of Formula 10 and of hexakis(p-trimethylsilylphenyl)cyclotrisiloxane of Formula were copolymerized. The polymerization was conducted in the absence of a solvent at a temperature of about 180 C. with a quantity of potassium naphthalene equivalent to 40 p.p.m. of potassium hydroxide based on the polysiloxane. The viscosity of the polymerization mixture increased sufficiently to stop the stirrer in about 1 second. Heating was continued for an additional 5 minutes and, the polymer was recovered by the method described for Examples l-6. It had an intrinsic viscosity of 1.15 dl./g. and had about 48.5 percent units of Formula 11, 48.5 percent units of Formula 16, and 3- percent units of Formula 12.

These polymers when heated in the air would not crosslink showing the heat stability of the trimethylsilylphenyl group.

Example 28 Employing the same general procedures and reaction conditions as used in Examples 7-15, a cyclotrisiloxane which corresponds to Formula 6 where R is as shown in Formula 2 with the trimethylsilyl group in the ortho position and each R sustituent is phenyl, is homopolymerized. The resultant polymer has the average formula:

1.67 -iiowhich corresponds to Formula 1 where R is as shown in Formula 2 with the trimethylsilyl group in the ortho position, R is phenyl, a is 0.33, and b is 1.67.

Example 29 Employing the same general reaction conditions as described for Examples 25 and 26, a quantity of 3300 parts of trialkylsilylphenyl-substituted cyclotrisiloxane of formula:

(Gunner- 3 Gourmet CH: 0113 CH2 CH3 which corresponds to Formula 6 with R and the R substituent on the corresponding silicon atom as shown in Formula 4 where each R" is ethyl, and the remaining R substituents are tolyl; and 100 parts of octamethylcyclotetrasiloxane are copolymerized. The resulting copolymer is comprised of about percent of portions of average mmer This corresponds to the material of Formula 6 with R and 13 14 the R substituent on the corresponding silicon atom as 4. The organopolysiloxane of claim 1 having portions shown in Formula 3 where R" is propyl, and the remainof the average formula:

ing R substituents are phenyl. The resulting polymer Si(CHa)a 0.01

and of the average formula:

s iwaflm 0.67 15 w m corresponding to Formula 1 with R as shown in Formula 3 where R" is propyl, R is phenyl, a is 0.67, and b is 1.33.

The polymers of the present invention are extremelyuseful in providing heat-resistant coatings on various ma- 2 terials. For example, mufilers and tailpipes of automobiles may be coated inside and out with solutions of these polymers, particularly those containing vinyl spbstituents where the solution also contains from about 0.1 to 10 The organopolyslloxane of havmg, an percent dicumyl peroxide and the solvent evaporated to amount of from to P umts of formula: leave behind a heat-resistant and corrosion-resistant film which can increase the life of these automobile parts. Ad- R ditionally, solutions of these compounds can be applied to ovens and ranges, the solvent evaporated to give, again, a heat-resistant surface which also minimizes the adhesion of many foodstuffs which may be inadvertently spilled on, or come in contact with, the treated oven or Where is Selected from the class consisting of monorange surfa e, valent lower alkyl groups and monovalent aryl groups.

While specific embodiments of the invention have been The organopolysiloxane of Claim 5 having PortionS shown and described, the invention should not be limited 0f avfiragfi formula; to the particular methods of formation and compositions. It is intended, therefore, by the appended claims, to cover all modifications within the spirit and scope of this invention.

What I claim as new and desire to secure by Letters 40 Patent of the United States is:

1. An organopolysiloxane consisting essentially of the io" average formula:

Run'bsio where R is a trialkylsilylphenyl group selected from the I class consisting of: Si(CH3)a 0.67

C SiR"3 Si H 3 3 and of average formula: 31R; and

where R" is a member selected from the class consisting of ethyl and propyl; R is selected from the class consistin of monovalent aryl groups and trialkylsilylphenyl groups as defined for R, a is from 0.33 to 2.0, b is from CHFCH 0 to 1.67, and the sum of a and b is from 1.98 to 2.01.

2. The organopolysiloxane of claim 1 consisting essen- 4 tially of the average formula:

'7. The organopolysiloxane of claim 5 having portions of the average formula: g

s)3 e1 3. The organopolysiloxane of claim 1 consisting essentially of recurring units of the formula:

snoHm 1.33

sio- I K M sioand of average formula:

8. The organopolysiloxane of claim having units of formula:

Si(CHa)s CH=CH1 iii) 9. The organopolysiloxane of claim 5 having portions of average formula:

and

10. The organopolysiloxane of claim 5 having portions of average formulas:

K ah and 11. The organopolysiloxane of claim 5 having portions of average formulas:

1.33 -S iO Si(CH:)a

0.67 Si(CHz)a) and -12. A copolymeric organopolysiloxane consisting essentially of from 0.1 to 99.9 percent portions of average formula:

and from 99.9 to 0.1 percent portions of average formula:

R SiO where R is a trialkylsilylphenyl group selected from the class consisting of:

II a)a where R" is a member selected from the class consisting of ethyl and propyl; R is selected from the class consisting of monovalent aryl groups and trialkylsilylphenyl groups as defined for R, a is from 0.33 to 2.0, b is from 17 0 to 1.67, and the sum of a and b is from 1.98 to 2.01; R is selected from the class consisting of monovalent aryl groups and monovalent lower alkyl groups, no more than 10 percent of the total R, R and R substituents being lower alkyl, and m is from 1 to 3.

13. The eopolymeric organopolysiloxane of claim 12 having, in an amount of from 0.5 to 5 nercent, units of formula:

References Cited UNITED STATES PATENTS 2,696,480 12/1954 Gordon et al. 260-465 5 3,234,180 2/1966 Wu 26046.5 3,278,461 10/1966 Wu 26046.5 3,325,530 6/1967 Wu 260-465 DONALD E. CZAJA, Primary Examiner.

10 M. I. MARQUIS, Assistant Examiner.

UNITED STATES PATENT OFFICE CERTIFICATE OF CORRECTION Patent No. 3,385,821 May 28, 1968 Tse C. Wu

It is certified that error appears in the above identified patent and that said Letters Patent are hereby corrected as shown below:

In the heading to the printed specification, lines 4 and S,

"9 Clemente Lane, Waterford, N. Y. 12188" should read Waterford, N. Y. assignor to General Electric Company, a

corporation of New York Signed and sealed this 3rd day of February 1970.

(SEAL) Attest:

WILLIAM E. SCHUYLER, JR.

Commissioner of Patents Edward M. Fletcher, Jr.

Attesting ()fficer 

